Nano Imprint ( ANT Series )

 Local Mask Aligner  /  SpinCoater

 

   열경화 / 광경화, 하이브리드 방식 
   나노 임프린트
 
 
    > ANT-4 <
 
     Curing Type :  UV (Ultra - Violet)
     Stamp  :  Quartz, Si, PFPE, PDMS, PC
     Imprinting Condition : Wafer : 1 - 4inch  
                       Imprinting Pressure ≤ 2bar
                      Single Layer / Single Step
     Imprinting Head  :  
               Chip-Size Multi-Head, Imprint Unit
               Multiple Fixturing/Air Chucking
     X,Y,Z Stage  :  Stroke - 250 x 120 x 25mm  
                        Z sliding Unit
     UV System  :  40mW/cm²
     Anti Vibration  :   Cut-off : 1~1.5Hz
     System Controller  :  UMAC-2
 
 Additional info   NIL Brochure (22.5MB PDF)
 
 
 
   > Local Mask Aligner <
 
     Feature
 
     > High resolution top and bottom side split
       field microscopes
     > Handling of multiple wafer size with quick
       change - over time
     > High degree of automation ( multiple send/
       receive cassettes )
     > Manual substrate loading capability on 
       automated system
     > Windows® based user interface
     > Options
       ( - Cassette to cassette handling system
         - Automatic alignment
         - Field upgradeable from manual to fully
         - automated version
         - NanoAlign package for enhanced process
           capabilities
         - Thin or Warped wafer handling
         - Nanoimprint lithography and micro 
           contact printing
         - Bond alignment
         - Simulation software for mask aligner
           lithography process )
 

 

   > ANT-6H,R <
 
   Curing Type : UV, Thermal, UV + Thermal
   Stamp :  Quartz, Si, Ni, PMMA, PDMS, PC, PUA
              Wafer : 1 - 6inch
   Implinting Condition : Imprinting Pressure
                        ≤ 2bar(UV) ≤ 60bar(TH)
                      Single layer / Single step
   Imprinting Head  :  Chip-Size Multi-Head,
                          Imprint Unit
   X,Z Stage / Unit: X - LM 450mm
                        Z - Sliding Unit 150mm
   UV System : > 50mW/cm²
   Temperature : RT ~ 250 °C
   Heating / Cooling V.: Heating : 20 °C/Cm
                             Cooling : 15 °C/Cm
   Vacuum : > 10¯2 Torr
   Anti Vibration Unit: Cut-off - 1~1.5HzUnit
   Controller  :  PLC (Touch Screen)
 
 Additional info  NIL Brochure (22.5MB PDF)
 
 
 
   > Spin Coater <
 
    전화상담요망

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

  Materials ( Wafer, Mask )

   Foundry Service

 

   - Si, Quartz, SOI, Sapphire Wafer
   - Glass Pyrex
   - Customized Mask Supply
   - NIL Stamp Supply
   - AFM Tip

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 
 
   > E-Beam lithography <
     - Minimum Line Width : Under 100nm Possible
 
   > Resist Coating <  
     - Coating Thickness 100nm-100um
 
   > Etching <
     - Wafer Thickness : 30um-1mm
     - Aspect ratio : Max. 1:30
     - Etching rate : > 8um/min
     - Selectivity :   PR: >1:30, Sio2: >1:100
 
   > Photo Mask Blank <
     - Chrome Photo mask Blank
     - Soda lime and Quartz Glass
     - Large Size Blank for LCD, Packging&PCB 
       Industries
     - 4 to 14" Soda lime Blank
     - 5009,6009,6012,6025 Quartz G-line 
       LCD/Blank
     - 6025 Quartz l-line Blank
 
   > Patterning <
     - Mask Size : 2.5"-8" mask
     - Pattern Size : Minimum 1um Possible