THE STAND-ALONE PLASMA-ACTIVATION (SPA)
TOOL IS A SMALL FOOTPRINT TOOL DESIGNED
TO PROVIDE A REACTIVE SURFACE TO BOND
SILICON WAFERS AND HETEROGENEOUS
SUBSTRATES.
The SiGen PA Tool allows room-temperature
bonding up to 80% of bulk covalent bond
strength.
The plasma technology utilizes proprietary
dual-frequency RF sources to activate wafer
substrates prior to bonding.
The stand-alone system allows the integration
of SiGen's PA benefits for high yield and
throughput substrate production using
non-plasma bond equipment.
Plasma Activation offers room temperature
bonding with a bond strength up to 80% of bulk
silicon (i.e., 80% of the force necessary to
pull a silicon wafer apart at any lattice
plane).
A short, relatively low-temperature anneal
brings the bond strength to 100% of bulk
silicon.
The process chamber is a dual frequency
parallel plate reactor that consists of top
and bottom parallel plate electrodes.
The top electrode serves as the "source"
electrode with the bottom electrode as the
"bias" electrode.
Each electrode is connected to an RF generator
via an RF match.
The top lid swings open on a hinge assembly to
allow for wafer introduction into and retrieval
from the chamber.
At the bottom of the chamber body, there are
an exhaust port and inlet for process gas.
Mass Flow Controllers (MFC) regulate the gas
flow.
The electronics components are housed in a
separate control rack.
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THE DB&C TOOL IS A SMALL FOOTPRINT TOOL
DESIGNED FOR LAYER TRANSFER APPLICATIONS
IN HIGH VOLUME MANUFACTURING.
Applications:
- SOI (silicon-on-insulator)
Used to reduce device voltage operation and
power consumption, improve device speed.
- DSB (direct silicon bond)
Improved device mobility in CMOS circuitry
by providing separate crystal orientation
layers for NMOS and PMOS.
- SOQ (silicon-on-quartz)
Transferred single-crystal silicon onto a
quartz substrate used for RF, display and
optical applications.
- SOG (silicon-on-glass)
Transferred single-crystal silicon onto
bulk glass enabling low-cost,
high-efficiency solar cells, displays, and
optical applications.
- CSS (customer-specific-substrate)
A combination of donor-layer materials on
unique handle substrates, including III-V
and II-VI donor materials and sapphire,
ceramics, and flexible handle substrates.
The process is a dynamic, low stress cleave
action in which a donor layer transfers to a
handle wafer at room temperature.
SiGen's proprietary cleave technology combines
a cleave initiation action followed by
programmed propagation that optimizes cleave
quality and uniformity.
Additional info
Debond & Cleave Tool (DB&C) (275KB PDF Format)
Homepage : http://www.sigen.net
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