o 2005.12 - ¿¢»çÅ×Å© ¼³¸³
- RAITH(µ¶ÀÏ) Þä / E-beam Lithography system ´ë¸®Á¡ °è¾à ü°á
- SAWATEC Þä / Mass Production¿ë ¹× R&D Spin, Spray Coater,Developer, Hot & Cool Plate
´ë¸®Á¡ °è¾à ü°á
- AllResistÞä/ MEMS, Nano, Nano Imprint¿ë Photo Resist ´ë¸®Á¡°è¾à ü°á
o 2006.02
- SiGen Þä / Mass Production¿ëPlasma Activation, 3D Stacking¿ë Cleave Tool ´ë¸®Á¡ °è¾à ü°á
- YES Þä / Plasma Asher, Plasma Cleaner, Vacuum Oven ´ë¸®Á¡ °è¾à ü°á
o 2006.05
- Alcatel Þä / Sub Dealer°è¾à ü°á–Si Deep Etching System
o 2007.08
- ÇѾç´ë ¾È»ê Ä·ÆÛ½º³» ¢ß½ºÅ¸ÀÏ·¯½º¸â½º ¼³¸³
- Alcatel Þä / Si Deep Etching °øÁ¤ ¹× Probe card ¿ë µµ±Ý°øÁ¤ ¼ºñ½º°³½Ã
- 2008.09 º¥Ã³È¸»ç·Î º¯È¯ ¿¹Á¤
o 2008.04
- Çѱ¹±â°è¿¬±¸¿ø°ú Photo AlignerÀÇ °øµ¿ °³¹ß ¹× ±â¼ú ±¹»êȸ¦ À§ÇØ ¾÷¹« Á¦ÈÞ ¹× ±¹³» ÆÇ¸Å ÇùÁ¤ ¿¹Á¤
o 2008.08
- Çѱ¹»ý»ê±â¼ú¿¬±¸¿ø ¹× ÇѾç´ë »êÇÏ MBC ¼¾ÅÍ¿Í E-beam Litho-graphy ¹× Nanoimprint ¿Í Photo
°øÁ¤¿ëÀ¸·Î Metal Resist(Thin film)À» °øµ¿ ÅõÀÚ ¹× Fund ½ÅûÇÏ¿© °³¹ß °èȹ
o 2008.09
- '¢ß½ºÅ¸ÀÏ·¯½º¸â½º' ´Â '¢ß¿¤¶õÅ×Å©³î·¯Áö' ·Î »óÈ£ º¯°æ ¹× Çѱ¹»ý»ê±â¼ú¿ø º¥Ã³Çõ½Å°ü À¸·Î ÀÌÀü
o 2009.02
- Çѱ¹»ý»ê±â¼ú¿ø°ú Spin CoaterÀÇ °øµ¿ °³¹ß ¹× ±â¼ú ±¹»êȸ¦ À§ÇØ ¾÷¹« Á¦ÈÞ ¹× ±¹³»ÆÇ¸Å
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